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sponsored by Alcatel-Lucent
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sponsored by Telelogic, An IBM Company
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sponsored by Bitpipe
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sponsored by Interlink Networks, Inc.
PRODUCT OVERVIEW - The Interlink Networks Diameter Acceleration Program provides OEMs, system integrators, and mobile carriers with a set of resources for designing, implementing, and advancing the deployment of the Diameter protocol for next generation mobile IP networks. Posted: September 24, 2003 | Published: September 1, 2003
Topics: AAA | IP Networks | NGN | RADIUS Protocol | Security Standards | Wireless Networks | Wireless Security
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